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DCB Substrates

 

IXYS

LSIS

 

 

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Direct-Copper-Bonded Alumina Substrates

 

Features:

  • 0.25-1mm thick ceramic with 0,3mm copper bonded on both sides with Optional Nickel plating
  • DCB thermal expansion matches silicon

 

Optimized for use in power hybrids Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance

  • Good Thermal Conductivity
  • Very Good Thermal Cycling Capability
  • Good Heat Spreading, leaving no hot spots
  • Can be Structured like PCB or ‘IMS Substrate’
  • Basis for “Chip-on-board” technology
  • 0.25-1mm thick ceramic with 0,3mm copper bonded on both sides with Optional Nickel plating
  • DCB thermal expansion matches silicon
  • Optimized for use in power hybrids Excellent Mechanical Strength, Stable Shape with Good Adhesion & Corrosion Resistance
  • Good Thermal Conductivity
  • Very Good Thermal Cycling Capability
  • Good Heat Spreading, leaving no hot spots
  • Can be Structured like PCB or ‘IMS Substrate’
  • Basis for “Chip-on-board” technology

 

Direct-Copper-Bonded Alumina Substrates

 

Télécharger la datasheet

 

 

 

 

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Integrated Base Plate Power Modules

 

New ISP Technology :

  • Direct Ceramic Coating on Base Plate
  • Plasma Sputtered Patterns

 

IBP